Frequency104MHz
PackageSOIC W
Current40mA
MountingSurface Mount
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Technical Specifications
Winbond W25Q64FVSFIG technical specifications.
General
Access Time-Max
8.5ns
Address Bus Width
1b
Package/Case
SOIC W
Density
64Mb
Frequency
104MHz
Interface
SPI, Serial
Max Operating Temperature
85°C
Max Supply Voltage
3.6V
Memory Size
64Mb
Memory Type
Non-Volatile, , FLASH
Min Operating Temperature
-40°C
Min Supply Voltage
2.7V
Mount
Surface Mount
Packaging
Rail/Tube
Page Size
256B
Radiation Hardening
No
RoHS Compliant
No
Series
SpiFlash®
Supply Current
40mA
Sync/Async
Synchronous
Word Size
8b
Compliance
RoHS
Not CompliantNo
Datasheet
Winbond W25Q64FVSFIG Datasheet
Download the complete datasheet for Winbond W25Q64FVSFIG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.