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Technical Specifications
Winbond W25Q64FVTCIG technical specifications.
General
Address Bus Width
1b
Package/Case
TBGA
Density
64Mb
Frequency
104MHz
Interface
SPI, Serial
Max Operating Temperature
85°C
Memory Size
64Mb
Memory Type
Non-Volatile, , FLASH
Min Operating Temperature
-40°C
Mount
Surface Mount
Packaging
Rail/Tube
Page Size
256B
Radiation Hardening
No
Series
SpiFlash®
Compliance
RoHS
Not CompliantNo
Datasheet
Winbond W25Q64FVTCIG Datasheet
Download the complete datasheet for Winbond W25Q64FVTCIG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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