Frequency80MHz
PackageSOIC
Current18mA
MountingSurface Mount
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Technical Specifications
Winbond W25Q80BLSNIG technical specifications.
General
Access Time-Max
9ns
Address Bus Width
24b
Package/Case
SOIC
Density
8Mb
Frequency
80MHz
Interface
SPI, Serial
Max Operating Temperature
85°C
Memory Size
8Mb
Memory Type
Non-Volatile, , FLASH
Min Operating Temperature
-40°C
Max Supply Voltage
3.6V
Min Supply Voltage
2.3V
Mount
Surface Mount
Packaging
Tape and Reel
Page Size
256B
Radiation Hardening
No
RoHS Compliant
Yes
Series
SpiFlash®
Supply Current
18mA
Sync/Async
Synchronous
Word Size
8b
Compliance
RoHS
Compliant
Datasheet
Winbond W25Q80BLSNIG Datasheet
Download the complete datasheet for Winbond W25Q80BLSNIG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.