Frequency104MHz
PackageDIP
MountingThrough Hole
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Technical Specifications
Winbond W25Q80BVDAIG technical specifications.
General
Address Bus Width
1b
Package/Case
DIP
Density
8Mb
Frequency
104MHz
Interface
SPI, Serial
Max Operating Temperature
85°C
Memory Size
8Mb
Memory Type
Non-Volatile, , FLASH
Min Operating Temperature
-40°C
Mount
Through Hole
Operating Supply Voltage
3.3V
Packaging
Rail/Tube
Page Size
256B
Radiation Hardening
No
RoHS Compliant
Yes
Series
SpiFlash®
Compliance
RoHS
Compliant
Datasheet
Winbond W25Q80BVDAIG Datasheet
Download the complete datasheet for Winbond W25Q80BVDAIG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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