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Technical Specifications
Winbond W25X20BLSNIG technical specifications.
General
Access Time-Max
7ns
Address Bus Width
24b
Package/Case
SOIC
Density
2Mb
Interface
SPI, Serial
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Max Supply Voltage
3.6V
Min Supply Voltage
2.3V
Mount
Surface Mount
Number of Words
512000
Page Size
256B
Radiation Hardening
No
RoHS Compliant
Yes
Supply Current
12mA
Sync/Async
Synchronous
Word Size
8b
Compliance
RoHS
Compliant
Datasheet
Winbond W25X20BLSNIG Datasheet
Download the complete datasheet for Winbond W25X20BLSNIG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.