Frequency104MHz
PackageSOIC
Current16.5mA
MountingSurface Mount
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Technical Specifications
Winbond W25X20BVSNIG technical specifications.
General
Access Time-Max
7ns
Address Bus Width
24b
Package/Case
SOIC
Density
2Mb
Frequency
104MHz
Interface
SPI, Serial
Max Operating Temperature
85°C
Memory Size
2Mb
Memory Type
Non-Volatile, , FLASH
Min Operating Temperature
-40°C
Max Supply Voltage
3.6V
Min Supply Voltage
2.7V
Mount
Surface Mount
Operating Supply Voltage
3.3V
Packaging
Rail/Tube
Page Size
256B
Radiation Hardening
No
RoHS Compliant
Yes
Series
SpiFlash®
Supply Current
16.5mA
Sync/Async
Synchronous
Word Size
1b
Compliance
RoHS
Compliant
Datasheet
Winbond W25X20BVSNIG Datasheet
Download the complete datasheet for Winbond W25X20BVSNIG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.