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Technical Specifications
Winbond W25X40BLSNIG technical specifications.
General
Address Bus Width
24b
Package/Case
SOIC
Density
4Mb
Interface
SPI, Serial
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Operating Supply Voltage
2.5V
Page Size
256B
Radiation Hardening
No
RoHS Compliant
Yes
Compliance
RoHS
Compliant
Datasheet
Winbond W25X40BLSNIG Datasheet
Download the complete datasheet for Winbond W25X40BLSNIG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.