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Technical Specifications
Winbond W25X40BLSNIG technical specifications.
General
| Address Bus Width | 24b |
| Package/Case | SOIC |
| Density | 4Mb |
| Interface | SPI, Serial |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Operating Supply Voltage | 2.5V |
| Page Size | 256B |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
Compliance
| RoHS | Compliant |
Datasheet
Winbond W25X40BLSNIG Datasheet
Download the complete datasheet for Winbond W25X40BLSNIG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.