Frequency104MHz
PackagePDIP
Current16.5mA
MountingThrough Hole
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Technical Specifications
Winbond W25X40BVDAIG technical specifications.
General
Access Time-Max
7ns
Address Bus Width
24b
Package/Case
PDIP
Density
4Mb
Frequency
104MHz
Interface
SPI, Serial
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Max Supply Voltage
3.6V
Memory Size
4Mb
Memory Type
Non-Volatile, , FLASH
Min Supply Voltage
2.7V
Mount
Through Hole
Operating Supply Voltage
3.3V
Packaging
Rail/Tube
Page Size
256B
Radiation Hardening
No
RoHS Compliant
Yes
Series
SpiFlash®
Supply Current
16.5mA
Sync/Async
Synchronous
Word Size
1b
Compliance
RoHS
Compliant
Datasheet
Winbond W25X40BVDAIG Datasheet
Download the complete datasheet for Winbond W25X40BVDAIG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.