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Technical Specifications
Winbond W25X40CLSSIG technical specifications.
General
| Package/Case | SOIC |
| Interface | SPI, Serial |
| Max Operating Temperature | 85°C |
| Memory Type | FLASH, |
| Min Operating Temperature | -40°C |
| Package Quantity | 90 |
| Packaging | Rail/Tube |
| RoHS Compliant | Yes |
| Series | SpiFlash® |
Compliance
| RoHS | Compliant |
Datasheet
Winbond W25X40CLSSIG Datasheet
Download the complete datasheet for Winbond W25X40CLSSIG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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