Quick Jump:
Technical Specifications
Winbond W29GL032CB7A technical specifications.
General
Access Time
70ns
Access Time-Max
70ns
Address Bus Width
21b
Package/Case
TFBGA
Density
32Mb
Interface
Parallel
Max Operating Temperature
85°C
Max Supply Voltage
3.6V
Memory Size
32Mb
Memory Type
Non-Volatile, , FLASH, NOR
Min Operating Temperature
-40°C
Min Supply Voltage
2.7V
Mount
Surface Mount
Packaging
Rail/Tube
Radiation Hardening
No
RoHS Compliant
Yes
Supply Current
55mA
Sync/Async
Asynchronous
Compliance
RoHS
Compliant
Datasheet
Winbond W29GL032CB7A Datasheet
Download the complete datasheet for Winbond W29GL032CB7A to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.