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Technical Specifications
Winbond W29GL064CB7S technical specifications.
General
| Access Time | 70ns |
| Address Bus Width | 22b |
| Package/Case | TFSOP |
| Density | 64Mb |
| Interface | Parallel |
| Max Operating Temperature | 85°C |
| Memory Size | 64Mb |
| Memory Type | Non-Volatile, , FLASH |
| Min Operating Temperature | -40°C |
| Mount | Surface Mount |
| Packaging | Rail/Tube |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
Compliance
| RoHS | Compliant |
Datasheet
Winbond W29GL064CB7S Datasheet
Download the complete datasheet for Winbond W29GL064CB7S to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.