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Technical Specifications
Winbond W987D6HBGX6E technical specifications.
General
| Package/Case | TFBGA |
| Interface | Parallel |
| Max Operating Temperature | 85°C |
| Memory Type | RAM, , SDRAM |
| Min Operating Temperature | -25°C |
| Package Quantity | 312 |
| Packaging | Tray |
| RoHS Compliant | Yes |
Compliance
| RoHS | Compliant |
Datasheet
Winbond W987D6HBGX6E Datasheet
Download the complete datasheet for Winbond W987D6HBGX6E to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.