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Technical Specifications
Winbond W987D6HBGX6ETR technical specifications.
General
| Package/Case | TFBGA |
| Interface | Parallel |
| Max Operating Temperature | 85°C |
| Memory Type | RAM, , SDRAM |
| Min Operating Temperature | -25°C |
| Packaging | Tape and Reel |
Compliance
| RoHS | Compliant |
Datasheet
Winbond W987D6HBGX6ETR Datasheet
Download the complete datasheet for Winbond W987D6HBGX6ETR to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.