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Technical Specifications
Winbond W987D6HBGX7E technical specifications.
General
| Address Bus Width | 14b |
| Package/Case | VFBGA |
| Density | 128Mb |
| Interface | Parallel |
| Max Frequency | 133MHz |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -25°C |
| Max Supply Voltage | 1.95V |
| Memory Type | RAM, , SDRAM |
| Min Supply Voltage | 1.7V |
| Mount | Surface Mount |
| Operating Supply Voltage | 1.8V |
| Organization | 8MX16 |
| Package Quantity | 312 |
| Packaging | Tray |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Supply Current | 70mA |
Compliance
| RoHS | Compliant |
Datasheet
Winbond W987D6HBGX7E Datasheet
Download the complete datasheet for Winbond W987D6HBGX7E to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.