Field Programmable Gate Array (FPGA) with 101,261 logic cells and 126,576 registers, built on 45nm process technology. This device features 480 maximum user I/Os, 4824 Kbit RAM bits, and 360 18x18 multipliers. It includes 180 dedicated DSP blocks and 18 DLLs/PLLs, with 268 total Block RAM. The FPGA operates within a 0 °C to 85 °C temperature range and supports transceiver speeds up to 3.2 Gbps. Packaged in a 676-pin Fine Pitch Ball Grid Array (FBGA) measuring 27x27x1.73 mm, it is designed for surface mounting.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX100-L1FG676C technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
676
PCB
676
Package Length (mm)
27
Package Width (mm)
27
Package Height (mm)
1.73
Seated Plane Height (mm)
2.23
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-034AAL-1
Family Name
Spartan®-6 LX
Maximum Number of User I/Os
480
Number of Registers
126576
RAM Bits
4824Kbit
Device Logic Cells
101261
Process Technology
45nm
Number of Multipliers
360 (18x18)
Programmability
Yes
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Dedicated DSP
180
Speed Grade
1L
Device Number of DLLs/PLLs
18
Total Number of Block RAM
268
Compliance
Cage Code
68994
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
3A991.d
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Xilinx XC6SLX100-L1FG676C Datasheet
Download the complete datasheet for Xilinx XC6SLX100-L1FG676C to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.