101,261 logic cells, 126,576 registers, and 4.824 Mbit of RAM characterize this Field Programmable Gate Array (FPGA). Featuring 360 18x18 multipliers and 180 dedicated DSP slices, it operates on 45nm technology. The device includes 8 transceiver blocks with speeds up to 3.2 Gbps and a PCI block. This surface-mount component is housed in a 324-pin Chip Scale Ball Grid Array (CSBGA) package measuring 15x15x0.9 mm with a 0.8 mm pin pitch, suitable for industrial temperature ranges from -40°C to 100°C.
PackageCSBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX100T-2CSG324I technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | CSBGA |
| Package Description | Chip Scale Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 324 |
| PCB | 324 |
| Package Length (mm) | 15 |
| Package Width (mm) | 15 |
| Package Height (mm) | 0.9 |
| Seated Plane Height (mm) | 1.5(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | Spartan®-6 LXT |
| Maximum Number of User I/Os | 232 |
| Number of Registers | 126576 |
| RAM Bits | 4824Kbit |
| Device Logic Cells | 101261 |
| Process Technology | 45nm |
| Number of Multipliers | 360 (18x18) |
| Programmability | Yes |
| Transceiver Blocks | 8 |
| Transceiver Speed | 3.2Gbps |
| Program Memory Type | SRAM |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 100°C |
| Dedicated DSP | 180 |
| PCI Blocks | 1 |
| Speed Grade | 2 |
| Device Number of DLLs/PLLs | 18 |
| Total Number of Block RAM | 268 |
Compliance
| Cage Code | 68994 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | 3A991.d |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Xilinx XC6SLX100T-2CSG324I Datasheet
Download the complete datasheet for Xilinx XC6SLX100T-2CSG324I to view detailed technical specifications.
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