Field Programmable Gate Array (FPGA) with 101,261 logic cells and 126,576 registers, built on 45nm process technology. Features 4824 Kbit RAM bits, 360 18x18 multipliers, and 180 dedicated DSP slices. Includes 8 transceiver blocks operating at 3.2 Gbps and 1 PCI block. This surface-mount device is housed in a 225-pin Chip Scale Ball Grid Array (CSBGA) package measuring 13mm x 13mm x 0.9mm, with a 0.8mm pin pitch. Offers 160 maximum user I/Os and operates within a temperature range of 0°C to 85°C.
PackageCSBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX100T-3CSG225C technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
CSBGA
Package Description
Chip Scale Ball Grid Array
Lead Shape
Ball
Pin Count
225
PCB
225
Package Length (mm)
13
Package Width (mm)
13
Package Height (mm)
0.9
Seated Plane Height (mm)
1.4(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Family Name
Spartan®-6 LXT
Maximum Number of User I/Os
160
Number of Registers
126576
RAM Bits
4824Kbit
Device Logic Cells
101261
Process Technology
45nm
Number of Multipliers
360 (18x18)
Programmability
Yes
Transceiver Blocks
8
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Dedicated DSP
180
PCI Blocks
1
Speed Grade
3
Device Number of DLLs/PLLs
18
Total Number of Block RAM
268
Compliance
Cage Code
68994
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Xilinx XC6SLX100T-3CSG225C Datasheet
Download the complete datasheet for Xilinx XC6SLX100T-3CSG225C to view detailed technical specifications.
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