Field Programmable Gate Array (FPGA) with 101,261 logic cells and 126,576 registers, built on 45nm process technology. Features 4,824 Kbit RAM bits, 360 18x18 multipliers, and 180 dedicated DSP blocks. Offers 376 maximum user I/Os and 8 transceiver blocks operating at 3.2 Gbps. This surface-mount device is housed in a 676-pin, 27mm x 27mm Fine Pitch Ball Grid Array (FBGA) package with a 1mm pin pitch. Operates within a temperature range of 0°C to 85°C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX100T-4FG676C technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 676 |
| PCB | 676 |
| Package Length (mm) | 27 |
| Package Width (mm) | 27 |
| Package Height (mm) | 1.73 |
| Seated Plane Height (mm) | 2.23 |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-034AAL-1 |
| Family Name | Spartan®-6 LXT |
| Maximum Number of User I/Os | 376 |
| Number of Registers | 126576 |
| RAM Bits | 4824Kbit |
| Device Logic Cells | 101261 |
| Number of Look-up Table Input | 6 |
| Process Technology | 45nm |
| Number of Multipliers | 360 (18x18) |
| Programmability | Yes |
| Transceiver Blocks | 8 |
| Transceiver Speed | 3.2Gbps |
| Program Memory Type | SRAM |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Dedicated DSP | 180 |
| PCI Blocks | 1 |
| Speed Grade | 4 |
| Device Number of DLLs/PLLs | 18 |
| Total Number of Block RAM | 268 |
Compliance
| Cage Code | 68994 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | 3A991.d |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Xilinx XC6SLX100T-4FG676C Datasheet
Download the complete datasheet for Xilinx XC6SLX100T-4FG676C to view detailed technical specifications.
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