
Field Programmable Gate Array (FPGA) with 147,443 logic cells and 184,304 registers, built on 45nm process technology. This device features 4,824 Kbit of RAM, 360 18x18 multipliers, and 180 dedicated DSP slices. It offers 160 user I/Os and 18 DLLs/PLLs, with transceiver speeds up to 3.2 Gbps. Packaged in a 225-pin Chip Scale Ball Grid Array (CSBGA) with a 0.8mm pin pitch, it supports surface mount installation and operates between 0°C and 85°C.
Xilinx XC6SLX150-2CSG225C technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | CSBGA |
| Package Description | Chip Scale Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 225 |
| PCB | 225 |
| Package Length (mm) | 13 |
| Package Width (mm) | 13 |
| Package Height (mm) | 0.9 |
| Seated Plane Height (mm) | 1.4(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | Spartan®-6 LX |
| Maximum Number of User I/Os | 160 |
| Number of Registers | 184304 |
| RAM Bits | 4824Kbit |
| Device Logic Cells | 147443 |
| Process Technology | 45nm |
| Number of Multipliers | 360 (18x18) |
| Programmability | Yes |
| Transceiver Speed | 3.2Gbps |
| Program Memory Type | SRAM |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Dedicated DSP | 180 |
| Speed Grade | 2 |
| Device Number of DLLs/PLLs | 18 |
| Total Number of Block RAM | 268 |
| Cage Code | 68994 |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
Download the complete datasheet for Xilinx XC6SLX150-2CSG225C to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.