
Field Programmable Gate Array (FPGA) with 147,443 logic cells and 184,304 registers, built on 45nm process technology. This device offers 4824 Kbit of RAM, 360 18x18 multipliers, and 180 dedicated DSP slices. Featuring 338 maximum user I/Os and 18 DLLs/PLLs, it operates with a transceiver speed of 3.2 Gbps. Packaged in a 484-pin Chip Scale Ball Grid Array (CSBGA) with a 0.8mm pin pitch, it supports surface mounting and operates within a temperature range of -40°C to 100°C.
Xilinx XC6SLX150-3CSG484I technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | CSBGA |
| Package Description | Chip Scale Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 484 |
| PCB | 484 |
| Package Length (mm) | 19 |
| Package Width (mm) | 19 |
| Package Height (mm) | 1.35(Max) |
| Seated Plane Height (mm) | 1.8(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | Spartan®-6 LX |
| Maximum Number of User I/Os | 338 |
| Number of Registers | 184304 |
| RAM Bits | 4824Kbit |
| Device Logic Cells | 147443 |
| Process Technology | 45nm |
| Number of Multipliers | 360 (18x18) |
| Programmability | Yes |
| Transceiver Speed | 3.2Gbps |
| Program Memory Type | SRAM |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 100°C |
| Dedicated DSP | 180 |
| Speed Grade | 3 |
| Device Number of DLLs/PLLs | 18 |
| Total Number of Block RAM | 268 |
| Cage Code | 68994 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | 3A991.d |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Xilinx XC6SLX150-3CSG484I to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.