Field Programmable Gate Array (FPGA) featuring 147,443 logic cells and 184,304 registers. This device utilizes 45nm process technology and offers 4,824 Kbit of RAM. It includes 360 integrated 18x18 multipliers and 180 dedicated DSP blocks. The FPGA is housed in a 484-pin Fine Pitch Ball Grid Array (FBGA) package with a 1mm pin pitch, designed for surface mounting. It supports up to 296 user I/Os and operates within a temperature range of 0°C to 85°C.
PackageFBGA
MountingSurface Mount
Quick Jump:
Technical Specifications
Xilinx XC6SLX150T-4FGG484C technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 484 |
| PCB | 484 |
| Package Length (mm) | 23 |
| Package Width (mm) | 23 |
| Package Height (mm) | 1.7 |
| Seated Plane Height (mm) | 2.2 |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | Spartan®-6 LXT |
| Maximum Number of User I/Os | 296 |
| Number of Registers | 184304 |
| RAM Bits | 4824Kbit |
| Device Logic Cells | 147443 |
| Process Technology | 45nm |
| Number of Multipliers | 360 (18x18) |
| Programmability | Yes |
| Transceiver Blocks | 8 |
| Transceiver Speed | 3.2Gbps |
| Program Memory Type | SRAM |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Dedicated DSP | 180 |
| PCI Blocks | 1 |
| Speed Grade | 4 |
| Device Number of DLLs/PLLs | 18 |
| Total Number of Block RAM | 268 |
Compliance
| Cage Code | 68994 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | 3A991.d |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Xilinx XC6SLX150T-4FGG484C Datasheet
Download the complete datasheet for Xilinx XC6SLX150T-4FGG484C to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.