
Field Programmable Gate Array (FPGA) with 14,579 logic cells and 18,224 registers, built on 45nm process technology. This device features 576 Kbit of RAM, 32 dedicated DSP blocks, and 64 18x18 multipliers. It offers 106 maximum user I/Os and a transceiver speed of 3.2 Gbps. Packaged in a 196-pin Chip Scale Ball Grid Array (CSBGA) measuring 8x8x0.8mm with a 0.5mm pin pitch, it supports surface mount installation and operates within a temperature range of 0°C to 85°C.
Xilinx XC6SLX16-2CPG196C technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | CSBGA |
| Package Description | Chip Scale Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 196 |
| PCB | 196 |
| Package Length (mm) | 8 |
| Package Width (mm) | 8 |
| Package Height (mm) | 0.8 |
| Seated Plane Height (mm) | 1 |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | Spartan®-6 LX |
| Maximum Number of User I/Os | 106 |
| Number of Registers | 18224 |
| RAM Bits | 576Kbit |
| Device Logic Cells | 14579 |
| Process Technology | 45nm |
| Number of Multipliers | 64 (18x18) |
| Programmability | Yes |
| Transceiver Speed | 3.2Gbps |
| Program Memory Type | SRAM |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Dedicated DSP | 32 |
| Speed Grade | 2 |
| Device Number of DLLs/PLLs | 6 |
| Total Number of Block RAM | 32 |
| Cage Code | 68994 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Xilinx XC6SLX16-2CPG196C to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.