Field Programmable Gate Array (FPGA) featuring 14,579 logic cells and 18,224 registers, built on 45nm process technology. This device offers 576 Kbit of RAM, 64 integrated 18x18 multipliers, and 32 dedicated DSP blocks. It supports transceiver speeds up to 3.2 Gbps and includes 32 Block RAMs and 6 DLLs/PLLs. The FPGA is housed in a 225-pin Chip Scale Ball Grid Array (CSBGA) package with a 0.8mm pin pitch, designed for surface mounting. Operating temperature range is -40 °C to 100 °C.
PackageCSBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX16-3CSG225I technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
CSBGA
Package Description
Chip Scale Ball Grid Array
Lead Shape
Ball
Pin Count
225
PCB
225
Package Length (mm)
13
Package Width (mm)
13
Package Height (mm)
0.9
Seated Plane Height (mm)
1.4(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Family Name
Spartan®-6 LX
Maximum Number of User I/Os
160
Number of Registers
18224
RAM Bits
576Kbit
Device Logic Cells
14579
Process Technology
45nm
Number of Multipliers
64 (18x18)
Programmability
Yes
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
-40°C
Max Operating Temperature
100°C
Dedicated DSP
32
Speed Grade
3
Device Number of DLLs/PLLs
6
Total Number of Block RAM
32
Compliance
Cage Code
68994
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Xilinx XC6SLX16-3CSG225I Datasheet
Download the complete datasheet for Xilinx XC6SLX16-3CSG225I to view detailed technical specifications.
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