Field Programmable Gate Array (FPGA) featuring 14,579 logic cells and 18,224 registers, built on 45nm process technology. This device offers 576 Kbit of RAM, 64 dedicated 18x18 multipliers, and 32 DSP blocks. It includes 576 user I/Os and operates with a transceiver speed of 3.2 Gbps. The component is housed in a 900-pin, 31mm x 31mm x 1.75mm Fine Pitch Ball Grid Array (FBGA) package for surface mounting, with an operating temperature range of -40°C to 100°C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX16-3FG900I technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
900
PCB
900
Package Length (mm)
31
Package Width (mm)
31
Package Height (mm)
1.75
Seated Plane Height (mm)
2.25
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-034
Family Name
Spartan®-6 LX
Maximum Number of User I/Os
576
Number of Registers
18224
RAM Bits
576Kbit
Device Logic Cells
14579
Process Technology
45nm
Number of Multipliers
64 (18x18)
Programmability
Yes
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
-40°C
Max Operating Temperature
100°C
Dedicated DSP
32
Speed Grade
3
Device Number of DLLs/PLLs
6
Total Number of Block RAM
32
Compliance
Cage Code
68994
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
3A991.d
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Xilinx XC6SLX16-3FG900I Datasheet
Download the complete datasheet for Xilinx XC6SLX16-3FG900I to view detailed technical specifications.
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