
Field Programmable Gate Array (FPGA) with 14,579 logic cells and 18,224 registers, built on 45nm process technology. Features 576 Kbit RAM bits, 64 18x18 multipliers, and 32 dedicated DSP blocks. Offers 232 maximum user I/Os and 6 DLLs/PLLs. This surface-mount device is housed in a 324-pin Chip Scale Ball Grid Array (CSBGA) package with a 0.8mm pin pitch, measuring 15mm x 15mm x 0.9mm. Operates within a temperature range of 0°C to 85°C.
Xilinx XC6SLX16-L1CSG324C technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | CSBGA |
| Package Description | Chip Scale Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 324 |
| PCB | 324 |
| Package Length (mm) | 15 |
| Package Width (mm) | 15 |
| Package Height (mm) | 0.9 |
| Seated Plane Height (mm) | 1.5(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | Spartan®-6 LX |
| Maximum Number of User I/Os | 232 |
| Number of Registers | 18224 |
| RAM Bits | 576Kbit |
| Device Logic Cells | 14579 |
| Process Technology | 45nm |
| Number of Multipliers | 64 (18x18) |
| Programmability | Yes |
| Transceiver Speed | 3.2Gbps |
| Program Memory Type | SRAM |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Dedicated DSP | 32 |
| Speed Grade | 1L |
| Device Number of DLLs/PLLs | 6 |
| Total Number of Block RAM | 32 |
| Cage Code | 68994 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | 3A991.d |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Xilinx XC6SLX16-L1CSG324C to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.