Field Programmable Gate Array (FPGA) with 24,051 logic cells and 30,064 registers, built on 45nm process technology. Features 106 user I/Os, 936 Kbit RAM, and 76 18x18 multipliers. This surface-mount device is housed in an 8x8mm Chip Scale Ball Grid Array (CSBGA) package with a 0.5mm pin pitch and 196 pins. Operates across a -40°C to 100°C temperature range.
PackageCSBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX25-3CPG196I technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
CSBGA
Package Description
Chip Scale Ball Grid Array
Lead Shape
Ball
Pin Count
196
PCB
196
Package Length (mm)
8
Package Width (mm)
8
Package Height (mm)
0.8
Seated Plane Height (mm)
1
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Family Name
Spartan®-6 LX
Maximum Number of User I/Os
106
Number of Registers
30064
RAM Bits
936Kbit
Device Logic Cells
24051
Process Technology
45nm
Number of Multipliers
76 (18x18)
Programmability
Yes
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
-40°C
Max Operating Temperature
100°C
Dedicated DSP
38
Speed Grade
3
Device Number of DLLs/PLLs
6
Total Number of Block RAM
52
Compliance
Cage Code
68994
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Xilinx XC6SLX25-3CPG196I Datasheet
Download the complete datasheet for Xilinx XC6SLX25-3CPG196I to view detailed technical specifications.
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