Field Programmable Gate Array (FPGA) with 24,051 logic cells and 30,064 registers. Features 936 Kbit RAM, 76 18x18 multipliers, and 38 dedicated DSP blocks. Operates on 45nm technology with a 1.2V core voltage. Offers 226 user I/Os and 6 DLLs/PLLs. Packaged in a 324-pin Chip Scale Ball Grid Array (CSBGA) with 0.8mm pin pitch, suitable for surface mounting. Supports transceiver speeds up to 3.2 Gbps and operates within a -40°C to 100°C temperature range.
PackageCSBGA
MountingSurface Mount
Quick Jump:
Technical Specifications
Xilinx XC6SLX25-3CSG324I technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
CSBGA
Package Description
Chip Scale Ball Grid Array
Lead Shape
Ball
Pin Count
324
PCB
324
Package Length (mm)
15
Package Width (mm)
15
Package Height (mm)
0.9
Seated Plane Height (mm)
1.5(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Family Name
Spartan®-6 LX
Maximum Number of User I/Os
226
Number of Registers
30064
RAM Bits
936Kbit
Device Logic Cells
24051
Process Technology
45nm
Number of Multipliers
76 (18x18)
Programmability
Yes
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
-40°C
Max Operating Temperature
100°C
Dedicated DSP
38
Speed Grade
3
Device Number of DLLs/PLLs
6
Total Number of Block RAM
52
Compliance
Cage Code
68994
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
3A991.d
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Xilinx XC6SLX25-3CSG324I Datasheet
Download the complete datasheet for Xilinx XC6SLX25-3CSG324I to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.