Field Programmable Gate Array (FPGA) with 24,051 logic cells and 30,064 registers, built on 45nm process technology. Features 936 Kbit RAM, 52 block RAMs, and 38 dedicated DSP slices. Offers 498 maximum user I/Os and 6 DLLs/PLLs. Operates at 1.2V with transceiver speeds up to 3.2 Gbps. Packaged in a 676-pin Fine Pitch Ball Grid Array (FBGA) for surface mounting, with dimensions of 27x27x1.73mm and a 1mm pin pitch.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX25-3FG676C technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 676 |
| PCB | 676 |
| Package Length (mm) | 27 |
| Package Width (mm) | 27 |
| Package Height (mm) | 1.73 |
| Seated Plane Height (mm) | 2.23 |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-034AAL-1 |
| Family Name | Spartan®-6 LX |
| Maximum Number of User I/Os | 498 |
| Number of Registers | 30064 |
| RAM Bits | 936Kbit |
| Device Logic Cells | 24051 |
| Process Technology | 45nm |
| Number of Multipliers | 76 (18x18) |
| Programmability | Yes |
| Transceiver Speed | 3.2Gbps |
| Program Memory Type | SRAM |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Dedicated DSP | 38 |
| Speed Grade | 3 |
| Device Number of DLLs/PLLs | 6 |
| Total Number of Block RAM | 52 |
Compliance
| Cage Code | 68994 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | 3A991.d |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Xilinx XC6SLX25-3FG676C Datasheet
Download the complete datasheet for Xilinx XC6SLX25-3FG676C to view detailed technical specifications.
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