Field Programmable Gate Array (FPGA) with 24,051 logic cells and 30,064 registers, built on 45nm process technology. Features 936 Kbit of RAM, 52 block RAMs, and 38 dedicated DSP slices. Offers 498 maximum user I/Os and 76 integrated 18x18 multipliers. Operates with a transceiver speed of 3.2 Gbps and is housed in a 676-pin Fine Pitch Ball Grid Array (FBGA) package suitable for surface mounting. Extended operating temperature range from -40 °C to 100 °C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX25-3FGG676I technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
676
PCB
676
Package Length (mm)
27
Package Width (mm)
27
Package Height (mm)
1.73
Seated Plane Height (mm)
2.23
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-034AAL-1
Family Name
Spartan®-6 LX
Maximum Number of User I/Os
498
Number of Registers
30064
RAM Bits
936Kbit
Device Logic Cells
24051
Process Technology
45nm
Number of Multipliers
76 (18x18)
Programmability
Yes
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
-40°C
Max Operating Temperature
100°C
Dedicated DSP
38
Speed Grade
3
Device Number of DLLs/PLLs
6
Total Number of Block RAM
52
Compliance
Cage Code
68994
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
3A991.d
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Xilinx XC6SLX25-3FGG676I Datasheet
Download the complete datasheet for Xilinx XC6SLX25-3FGG676I to view detailed technical specifications.
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