Field Programmable Gate Array (FPGA) with 24051 logic cells and 30064 registers, featuring 936 Kbit of RAM and 38 dedicated DSP slices. This device operates on a 45nm process technology, includes 76 (18x18) multipliers, and offers 106 user I/Os. It boasts 2 transceiver blocks with a speed of 3.2 Gbps, 1 PCI block, and 6 DLLs/PLLs. The FPGA is housed in a 196-pin Chip Scale Ball Grid Array (CSBGA) package, measuring 8x8x0.8mm with a 0.5mm pin pitch, designed for surface mounting and operating between 0°C and 85°C.
PackageCSBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX25T-2CPG196C technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | CSBGA |
| Package Description | Chip Scale Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 196 |
| PCB | 196 |
| Package Length (mm) | 8 |
| Package Width (mm) | 8 |
| Package Height (mm) | 0.8 |
| Seated Plane Height (mm) | 1 |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | Spartan®-6 LXT |
| Maximum Number of User I/Os | 106 |
| Number of Registers | 30064 |
| RAM Bits | 936Kbit |
| Device Logic Cells | 24051 |
| Process Technology | 45nm |
| Number of Multipliers | 76 (18x18) |
| Programmability | Yes |
| Transceiver Blocks | 2 |
| Transceiver Speed | 3.2Gbps |
| Program Memory Type | SRAM |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Dedicated DSP | 38 |
| PCI Blocks | 1 |
| Speed Grade | 2 |
| Device Number of DLLs/PLLs | 6 |
| Total Number of Block RAM | 52 |
Compliance
| Cage Code | 68994 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU |
Datasheet
Xilinx XC6SLX25T-2CPG196C Datasheet
Download the complete datasheet for Xilinx XC6SLX25T-2CPG196C to view detailed technical specifications.
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