24051 logic cells, 30064 registers, and 936 Kbit RAM characterize this Field Programmable Gate Array (FPGA). Featuring 45nm process technology, it offers 76 18x18 multipliers and 38 dedicated DSP blocks. The device includes 2 transceiver blocks operating at 3.2 Gbps and 1 PCI block. Housed in a 256-pin FTBGA package with a 1mm pin pitch, this surface-mount component supports a maximum of 186 user I/Os and operates within a -40°C to 100°C temperature range.
PackageFTBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX25T-2FTG256I technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FTBGA
Package Description
Fine Pitch Thin Ball Grid Array
Lead Shape
Ball
Pin Count
256
PCB
256
Package Length (mm)
17
Package Width (mm)
17
Package Height (mm)
1
Seated Plane Height (mm)
1.4
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-034AAF-1
Family Name
Spartan®-6 LXT
Maximum Number of User I/Os
186
Number of Registers
30064
RAM Bits
936Kbit
Device Logic Cells
24051
Process Technology
45nm
Number of Multipliers
76 (18x18)
Programmability
Yes
Transceiver Blocks
2
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
-40°C
Max Operating Temperature
100°C
Dedicated DSP
38
PCI Blocks
1
Speed Grade
2
Device Number of DLLs/PLLs
6
Total Number of Block RAM
52
Compliance
Cage Code
68994
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Xilinx XC6SLX25T-2FTG256I Datasheet
Download the complete datasheet for Xilinx XC6SLX25T-2FTG256I to view detailed technical specifications.
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