Field Programmable Gate Array (FPGA) with 24,051 logic cells and 30,064 registers, built on 45nm process technology. Features 160 user I/Os, 936 Kbit RAM, and 76 18x18 multipliers. Includes 2 transceiver blocks operating at 3.2 Gbps, 38 dedicated DSP slices, and 52 block RAMs. Packaged in a 225-pin CSBGA (Chip Scale Ball Grid Array) with a 0.8mm pin pitch, suitable for surface mounting. Operates within a temperature range of 0°C to 85°C.
PackageCSBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX25T-4CSG225C technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
CSBGA
Package Description
Chip Scale Ball Grid Array
Lead Shape
Ball
Pin Count
225
PCB
225
Package Length (mm)
13
Package Width (mm)
13
Package Height (mm)
0.9
Seated Plane Height (mm)
1.4(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Family Name
Spartan®-6 LXT
Maximum Number of User I/Os
160
Number of Registers
30064
RAM Bits
936Kbit
Device Logic Cells
24051
Process Technology
45nm
Number of Multipliers
76 (18x18)
Programmability
Yes
Transceiver Blocks
2
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Dedicated DSP
38
PCI Blocks
1
Speed Grade
4
Device Number of DLLs/PLLs
6
Total Number of Block RAM
52
Compliance
Cage Code
68994
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Xilinx XC6SLX25T-4CSG225C Datasheet
Download the complete datasheet for Xilinx XC6SLX25T-4CSG225C to view detailed technical specifications.
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