Field Programmable Gate Array (FPGA) with 3840 logic cells and 4800 registers, built on 45nm process technology. Features 216 Kbit RAM, 12 block RAMs, and 8 dedicated DSP slices, supporting up to 498 user I/Os. Operates at 1.2V with transceiver speeds up to 3.2 Gbps. Housed in a 676-pin Fine Pitch Ball Grid Array (FBGA) package, measuring 27x27mm with a 1mm pin pitch, suitable for surface mounting. Extended operating temperature range from -40°C to 100°C.
PackageFBGA
MountingSurface Mount
Quick Jump:
Technical Specifications
Xilinx XC6SLX4-3FG676I technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
676
PCB
676
Package Length (mm)
27
Package Width (mm)
27
Package Height (mm)
1.73
Seated Plane Height (mm)
2.23
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-034AAL-1
Family Name
Spartan®-6 LX
Maximum Number of User I/Os
498
Number of Registers
4800
RAM Bits
216Kbit
Device Logic Cells
3840
Process Technology
45nm
Number of Multipliers
16 (18x18)
Programmability
Yes
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
-40°C
Max Operating Temperature
100°C
Dedicated DSP
8
Speed Grade
3
Device Number of DLLs/PLLs
6
Total Number of Block RAM
12
Compliance
Cage Code
68994
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
3A991.d
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Xilinx XC6SLX4-3FG676I Datasheet
Download the complete datasheet for Xilinx XC6SLX4-3FG676I to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.