XILINX

XC6SLX45-2CSG324C

Xilinx

XC6SLX45-2CSG324C

Name: XC6SLX45-2CSG324C Xilinx
Brand: Xilinx
SKU: XC6SLX45-2CSG324C

FPGA 45nm 324-Pin CSBGA 43661 Cells 218 I/Os 3.2Gbps Transceiver

Field Programmable Gate Array (FPGA) with 43,661 logic cells and 54,576 registers, built on 45nm process technology. Features 2,088 Kbit RAM, 116 multipliers (18x18), and 58 dedicated DSP blocks. Offers 218 user I/Os and supports external memory interfaces including DDR, DDR2, DDR3, and LPDDR SDRAM. This surface-mount device is housed in a 324-pin Chip Scale Ball Grid Array (CSBGA) package with a 0.8mm pin pitch, measuring 15x15x0.9mm. Operates within a temperature range of 0°C to 85°C.

PackageCSBGA

MountingSurface Mount

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Technical Specifications

Xilinx XC6SLX45-2CSG324C technical specifications.

General

Basic Package Type	Ball Grid Array
Package Family Name	BGA
Package/Case	CSBGA
Package Description	Chip Scale Ball Grid Array
Lead Shape	Ball
Pin Count	324
PCB	324
Package Length (mm)	15
Package Width (mm)	15
Package Height (mm)	0.9
Seated Plane Height (mm)	1.5(Max)
Pin Pitch (mm)	0.8
Package Material	Plastic
Mounting	Surface Mount
Package Orientation	Yes
Package Orientation Marking Type	Dot
Jedec	MO-275KKAB-1
Family Name	Spartan®-6 LX
Maximum Number of User I/Os	218
Number of Registers	54576
RAM Bits	2088Kbit
Device Logic Cells	43661
Process Technology	45nm
Number of Multipliers	116 (18x18)
Programmability	Yes
Transceiver Speed	3.2Gbps
Program Memory Type	SRAM
Min Operating Temperature	0°C
Max Operating Temperature	85°C
Dedicated DSP	58
Speed Grade	2
External Memory Interface	DDR SDRAM\|DDR2 SDRAM\|DDR3 SDRAM\|LPDDR SDRAM
Device Number of DLLs/PLLs	12
Total Number of Block RAM	116

Compliance

Cage Code	68994
EU RoHS	Yes
HTS Code	8542390001
Schedule B	8542390000
ECCN	3A991.d
Automotive	No
AEC Qualified	No
PPAP	No
Radiation Hardening	No
RoHS Versions	2011/65/EU, 2015/863

Datasheet

No datasheet is available for this part.