Field Programmable Gate Array (FPGA) with 43,661 logic cells and 54,576 registers. Features 2088 Kbit RAM, 116 multipliers (18x18), and 58 dedicated DSP slices. Operates on 45nm process technology at 1.2V, offering 160 user I/Os and 12 DLLs/PLLs. This surface-mount device utilizes a 225-pin Chip Scale Ball Grid Array (CSBGA) package measuring 13x13x0.9mm with 0.8mm pin pitch. Supports transceiver speeds up to 3.2 Gbps and operates within a 0°C to 85°C temperature range.
PackageCSBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX45-3CSG225C technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
CSBGA
Package Description
Chip Scale Ball Grid Array
Lead Shape
Ball
Pin Count
225
PCB
225
Package Length (mm)
13
Package Width (mm)
13
Package Height (mm)
0.9
Seated Plane Height (mm)
1.4(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Family Name
Spartan®-6 LX
Maximum Number of User I/Os
160
Number of Registers
54576
RAM Bits
2088Kbit
Device Logic Cells
43661
Process Technology
45nm
Number of Multipliers
116 (18x18)
Programmability
Yes
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Dedicated DSP
58
Speed Grade
3
Device Number of DLLs/PLLs
12
Total Number of Block RAM
116
Compliance
Cage Code
68994
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Xilinx XC6SLX45-3CSG225C Datasheet
Download the complete datasheet for Xilinx XC6SLX45-3CSG225C to view detailed technical specifications.
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