Field Programmable Gate Array (FPGA) with 43,661 logic cells and 54,576 registers, built on 45nm process technology. Features 160 user I/Os, 2088 Kbit RAM, 116 (18x18) multipliers, and 58 dedicated DSP blocks. Operates with a transceiver speed of 3.2 Gbps and includes 12 DLLs/PLLs. Packaged in a 225-pin Chip Scale Ball Grid Array (CSBGA) measuring 13x13x0.9mm, designed for surface mounting. Extended operating temperature range from -40°C to 100°C.
PackageCSBGA
MountingSurface Mount
Quick Jump:
Technical Specifications
Xilinx XC6SLX45-3CSG225I technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
CSBGA
Package Description
Chip Scale Ball Grid Array
Lead Shape
Ball
Pin Count
225
PCB
225
Package Length (mm)
13
Package Width (mm)
13
Package Height (mm)
0.9
Seated Plane Height (mm)
1.4(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Family Name
Spartan®-6 LX
Maximum Number of User I/Os
160
Number of Registers
54576
RAM Bits
2088Kbit
Device Logic Cells
43661
Process Technology
45nm
Number of Multipliers
116 (18x18)
Programmability
Yes
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
-40°C
Max Operating Temperature
100°C
Dedicated DSP
58
Speed Grade
3
Device Number of DLLs/PLLs
12
Total Number of Block RAM
116
Compliance
Cage Code
68994
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Xilinx XC6SLX45-3CSG225I Datasheet
Download the complete datasheet for Xilinx XC6SLX45-3CSG225I to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.