Field Programmable Gate Array (FPGA) with 43,661 logic cells and 54,576 registers, built on 45nm process technology. Features 190 maximum user I/Os, 2088 Kbit RAM bits, and 116 (18x18) multipliers. Includes 4 transceiver blocks operating at 3.2 Gbps, 58 dedicated DSP slices, and 1 PCI block. Supports external memory interfaces including DDR, DDR2, DDR3, and LPDDR SDRAM. Packaged in a 324-pin Chip Scale Ball Grid Array (CSBGA) with a 0.8mm pin pitch, suitable for surface mounting. Operates within a temperature range of 0°C to 85°C.
PackageCSBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX45T-3CSG324C technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
CSBGA
Package Description
Chip Scale Ball Grid Array
Lead Shape
Ball
Pin Count
324
PCB
324
Package Length (mm)
15
Package Width (mm)
15
Package Height (mm)
0.9
Seated Plane Height (mm)
1.5(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Package Orientation
Yes
Package Orientation Marking Type
Dot
Jedec
MO-275KKAB-1
Family Name
Spartan®-6 LXT
Maximum Number of User I/Os
190
Number of Registers
54576
RAM Bits
2088Kbit
Device Logic Cells
43661
Process Technology
45nm
Number of Multipliers
116 (18x18)
Programmability
Yes
Transceiver Blocks
4
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Dedicated DSP
58
PCI Blocks
1
Speed Grade
3
External Memory Interface
DDR SDRAM|DDR2 SDRAM|DDR3 SDRAM|LPDDR SDRAM
Device Number of DLLs/PLLs
12
Total Number of Block RAM
116
Compliance
Cage Code
68994
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Xilinx XC6SLX45T-3CSG324C Datasheet
Download the complete datasheet for Xilinx XC6SLX45T-3CSG324C to view detailed technical specifications.
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