Field Programmable Gate Array (FPGA) featuring 43,661 logic cells and 54,576 registers. This device utilizes 45nm process technology, offers 2,088 Kbit of RAM, and includes 116 18x18 multipliers and 58 dedicated DSP blocks. It supports up to 576 user I/Os, four transceiver blocks operating at 3.2 Gbps, and one PCI block. Packaged in a 900-pin Fine Pitch Ball Grid Array (FBGA) for surface mounting, this component operates within a temperature range of -40°C to 100°C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX45T-3FGG900I technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
900
PCB
900
Package Length (mm)
31
Package Width (mm)
31
Package Height (mm)
1.75
Seated Plane Height (mm)
2.25
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-034
Family Name
Spartan®-6 LXT
Maximum Number of User I/Os
576
Number of Registers
54576
RAM Bits
2088Kbit
Device Logic Cells
43661
Process Technology
45nm
Number of Multipliers
116 (18x18)
Programmability
Yes
Transceiver Blocks
4
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
-40°C
Max Operating Temperature
100°C
Dedicated DSP
58
PCI Blocks
1
Speed Grade
3
Device Number of DLLs/PLLs
12
Total Number of Block RAM
116
Compliance
Cage Code
68994
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
3A991.d
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Xilinx XC6SLX45T-3FGG900I Datasheet
Download the complete datasheet for Xilinx XC6SLX45T-3FGG900I to view detailed technical specifications.
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