Field Programmable Gate Array (FPGA) with 43,661 logic cells and 54,576 registers, built on 45nm process technology. Features 2,088 Kbit of RAM, 116 (18x18) multipliers, and 58 dedicated DSP slices. Offers 4 transceiver blocks operating at 3.2 Gbps, 1 PCI block, and 12 DLLs/PLLs. Packaged in a 676-pin Fine Pitch Ball Grid Array (FBGA) for surface mounting, with a pin pitch of 1mm and an operating temperature range of -40°C to 100°C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX45T-4FGG676I technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 676 |
| PCB | 676 |
| Package Length (mm) | 27 |
| Package Width (mm) | 27 |
| Package Height (mm) | 1.73 |
| Seated Plane Height (mm) | 2.23 |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-034AAL-1 |
| Family Name | Spartan®-6 LXT |
| Maximum Number of User I/Os | 498 |
| Number of Registers | 54576 |
| RAM Bits | 2088Kbit |
| Device Logic Cells | 43661 |
| Process Technology | 45nm |
| Number of Multipliers | 116 (18x18) |
| Programmability | Yes |
| Transceiver Blocks | 4 |
| Transceiver Speed | 3.2Gbps |
| Program Memory Type | SRAM |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 100°C |
| Dedicated DSP | 58 |
| PCI Blocks | 1 |
| Speed Grade | 4 |
| Device Number of DLLs/PLLs | 12 |
| Total Number of Block RAM | 116 |
Compliance
| Cage Code | 68994 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | 3A991.d |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Xilinx XC6SLX45T-4FGG676I Datasheet
Download the complete datasheet for Xilinx XC6SLX45T-4FGG676I to view detailed technical specifications.
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