Field Programmable Gate Array (FPGA) featuring 74,637 logic cells and 93,296 registers. This device offers 3096 Kbit of RAM and 132 dedicated DSP slices, with 264 integrated 18x18 multipliers. Operating on a 45nm process technology, it supports transceiver speeds up to 3.2 Gbps and includes 18 DLLs/PLLs. The 196-pin Chip Scale Ball Grid Array (CSBGA) package measures 8x8x0.8mm with a 0.5mm pin pitch, designed for surface mounting.
PackageCSBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX75-2CPG196C technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | CSBGA |
| Package Description | Chip Scale Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 196 |
| PCB | 196 |
| Package Length (mm) | 8 |
| Package Width (mm) | 8 |
| Package Height (mm) | 0.8 |
| Seated Plane Height (mm) | 1 |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | Spartan®-6 LX |
| Maximum Number of User I/Os | 106 |
| Number of Registers | 93296 |
| RAM Bits | 3096Kbit |
| Device Logic Cells | 74637 |
| Process Technology | 45nm |
| Number of Multipliers | 264 (18x18) |
| Programmability | Yes |
| Transceiver Speed | 3.2Gbps |
| Program Memory Type | SRAM |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Dedicated DSP | 132 |
| Speed Grade | 2 |
| Device Number of DLLs/PLLs | 18 |
| Total Number of Block RAM | 172 |
Compliance
| Cage Code | 68994 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU |
Datasheet
Xilinx XC6SLX75-2CPG196C Datasheet
Download the complete datasheet for Xilinx XC6SLX75-2CPG196C to view detailed technical specifications.
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