Field Programmable Gate Array (FPGA) featuring 74,637 logic cells and 93,296 registers. This device offers 3096 Kbit of RAM and 132 dedicated DSP slices, with 264 integrated 18x18 multipliers. Operating on a 45nm process technology, it supports transceiver speeds up to 3.2 Gbps and includes 18 DLLs/PLLs. The 196-pin Chip Scale Ball Grid Array (CSBGA) package measures 8x8x0.8mm with a 0.5mm pin pitch, designed for surface mounting.
PackageCSBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX75-2CPG196C technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
CSBGA
Package Description
Chip Scale Ball Grid Array
Lead Shape
Ball
Pin Count
196
PCB
196
Package Length (mm)
8
Package Width (mm)
8
Package Height (mm)
0.8
Seated Plane Height (mm)
1
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Family Name
Spartan®-6 LX
Maximum Number of User I/Os
106
Number of Registers
93296
RAM Bits
3096Kbit
Device Logic Cells
74637
Process Technology
45nm
Number of Multipliers
264 (18x18)
Programmability
Yes
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Dedicated DSP
132
Speed Grade
2
Device Number of DLLs/PLLs
18
Total Number of Block RAM
172
Compliance
Cage Code
68994
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Xilinx XC6SLX75-2CPG196C Datasheet
Download the complete datasheet for Xilinx XC6SLX75-2CPG196C to view detailed technical specifications.
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