Field Programmable Gate Array (FPGA) featuring 74,637 logic cells and 93,296 registers. This device utilizes 45nm process technology and offers 3096 Kbit of RAM. It includes 264 dedicated 18x18 multipliers and 132 dedicated DSP blocks. The 256-pin FTBGA package (17x17mm) supports surface mounting and has a pin pitch of 1mm. Operating temperature range is 0°C to 85°C.
PackageFTBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX75-2FT256C technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FTBGA
Package Description
Fine Pitch Thin Ball Grid Array
Lead Shape
Ball
Pin Count
256
PCB
256
Package Length (mm)
17
Package Width (mm)
17
Package Height (mm)
1
Seated Plane Height (mm)
1.4
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-034AAF-1
Family Name
Spartan®-6 LX
Maximum Number of User I/Os
186
Number of Registers
93296
RAM Bits
3096Kbit
Device Logic Cells
74637
Process Technology
45nm
Number of Multipliers
264 (18x18)
Programmability
Yes
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Dedicated DSP
132
Speed Grade
2
Device Number of DLLs/PLLs
18
Total Number of Block RAM
172
Compliance
Cage Code
68994
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Xilinx XC6SLX75-2FT256C Datasheet
Download the complete datasheet for Xilinx XC6SLX75-2FT256C to view detailed technical specifications.
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