Field Programmable Gate Array (FPGA) with 74,637 logic cells and 93,296 registers, built on 45nm process technology. Features 3,096 Kbit RAM bits, 132 dedicated DSP slices, and 264 multipliers (18x18). Offers 186 maximum user I/Os and 172 total Block RAMs, with transceiver speeds up to 3.2 Gbps. Packaged in a 256-pin Fine Pitch Thin Ball Grid Array (FTBGA) with a 1mm pin pitch, suitable for surface mounting. Operates within a temperature range of 0°C to 85°C.
PackageFTBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX75-2FTG256C technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FTBGA
Package Description
Fine Pitch Thin Ball Grid Array
Lead Shape
Ball
Pin Count
256
PCB
256
Package Length (mm)
17
Package Width (mm)
17
Package Height (mm)
1
Seated Plane Height (mm)
1.4
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-034AAF-1
Family Name
Spartan®-6 LX
Maximum Number of User I/Os
186
Number of Registers
93296
RAM Bits
3096Kbit
Device Logic Cells
74637
Process Technology
45nm
Number of Multipliers
264 (18x18)
Programmability
Yes
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Dedicated DSP
132
Speed Grade
2
Device Number of DLLs/PLLs
18
Total Number of Block RAM
172
Compliance
Cage Code
68994
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Xilinx XC6SLX75-2FTG256C Datasheet
Download the complete datasheet for Xilinx XC6SLX75-2FTG256C to view detailed technical specifications.
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