Field Programmable Gate Array (FPGA) with 74,637 logic cells and 93,296 registers, built on 45nm process technology. Features 3096 Kbit of RAM, 132 dedicated DSP slices, and 264 18x18 multipliers. Offers 160 maximum user I/Os and 172 total block RAMs. Operates at 1.2V with transceiver speeds up to 3.2 Gbps. Housed in a 225-pin Chip Scale Ball Grid Array (CSBGA) package, measuring 13x13x0.9mm, for surface mounting.
PackageCSBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX75-3CSG225C technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
CSBGA
Package Description
Chip Scale Ball Grid Array
Lead Shape
Ball
Pin Count
225
PCB
225
Package Length (mm)
13
Package Width (mm)
13
Package Height (mm)
0.9
Seated Plane Height (mm)
1.4(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Family Name
Spartan®-6 LX
Maximum Number of User I/Os
160
Number of Registers
93296
RAM Bits
3096Kbit
Device Logic Cells
74637
Process Technology
45nm
Number of Multipliers
264 (18x18)
Programmability
Yes
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Dedicated DSP
132
Speed Grade
3
Device Number of DLLs/PLLs
18
Total Number of Block RAM
172
Compliance
Cage Code
68994
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Xilinx XC6SLX75-3CSG225C Datasheet
Download the complete datasheet for Xilinx XC6SLX75-3CSG225C to view detailed technical specifications.
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