Field Programmable Gate Array (FPGA) featuring 74,637 logic cells and 93,296 registers, built on 45nm process technology. This device offers 3096 Kbit of RAM, 264 18x18 multipliers, and 132 dedicated DSP slices. It supports transceiver speeds up to 3.2 Gbps and includes 18 DLLs/PLLs. The FPGA is housed in a 256-pin FTBGA (Fine Pitch Thin Ball Grid Array) package, measuring 17mm x 17mm x 1mm, designed for surface mounting with a 1mm pin pitch. Operating temperature range is -40°C to 100°C.
PackageFTBGA
MountingSurface Mount
Quick Jump:
Technical Specifications
Xilinx XC6SLX75-3FTG256I technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FTBGA |
| Package Description | Fine Pitch Thin Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 256 |
| PCB | 256 |
| Package Length (mm) | 17 |
| Package Width (mm) | 17 |
| Package Height (mm) | 1 |
| Seated Plane Height (mm) | 1.4 |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-034AAF-1 |
| Family Name | Spartan®-6 LX |
| Maximum Number of User I/Os | 186 |
| Number of Registers | 93296 |
| RAM Bits | 3096Kbit |
| Device Logic Cells | 74637 |
| Process Technology | 45nm |
| Number of Multipliers | 264 (18x18) |
| Programmability | Yes |
| Transceiver Speed | 3.2Gbps |
| Program Memory Type | SRAM |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 100°C |
| Dedicated DSP | 132 |
| Speed Grade | 3 |
| Device Number of DLLs/PLLs | 18 |
| Total Number of Block RAM | 172 |
Compliance
| Cage Code | 68994 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU |
Datasheet
Xilinx XC6SLX75-3FTG256I Datasheet
Download the complete datasheet for Xilinx XC6SLX75-3FTG256I to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.