Field Programmable Gate Array (FPGA) with 74,637 logic cells and 93,296 registers, built on 45nm process technology. Features 3,096 Kbit RAM, 264 18x18 multipliers, and 132 dedicated DSP blocks. Offers 102 maximum user I/Os and 172 total Block RAMs, with transceiver speeds up to 3.2 Gbps. Housed in a 144-pin TQFP (Thin Quad Flat Package) with a 0.5mm pin pitch, designed for surface mounting. Operates within a temperature range of 0°C to 85°C.
PackageTQFP
MountingSurface Mount
Quick Jump:
Technical Specifications
Xilinx XC6SLX75-3TQG144C technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
QFP
Package/Case
TQFP
Package Description
Thin Quad Flat Package
Lead Shape
Gull-wing
Pin Count
144
PCB
144
Package Length (mm)
20
Package Width (mm)
20
Package Height (mm)
1.4
Seated Plane Height (mm)
1.6(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-026BFB
Family Name
Spartan®-6 LX
Maximum Number of User I/Os
102
Number of Registers
93296
RAM Bits
3096Kbit
Device Logic Cells
74637
Process Technology
45nm
Number of Multipliers
264 (18x18)
Programmability
Yes
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Dedicated DSP
132
Speed Grade
3
Device Number of DLLs/PLLs
18
Total Number of Block RAM
172
Compliance
Cage Code
68994
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Xilinx XC6SLX75-3TQG144C Datasheet
Download the complete datasheet for Xilinx XC6SLX75-3TQG144C to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.