
Field Programmable Gate Array (FPGA) with 74,637 logic cells and 93,296 registers, built on 45nm process technology. Features 3,096 Kbit RAM, 264 18x18 multipliers, and 132 dedicated DSP blocks. Offers 102 maximum user I/Os and 172 total Block RAMs, with transceiver speeds up to 3.2 Gbps. Housed in a 144-pin TQFP (Thin Quad Flat Package) with a 0.5mm pin pitch, designed for surface mounting. Operates within a temperature range of 0°C to 85°C.
Xilinx XC6SLX75-3TQG144C technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | QFP |
| Package/Case | TQFP |
| Package Description | Thin Quad Flat Package |
| Lead Shape | Gull-wing |
| Pin Count | 144 |
| PCB | 144 |
| Package Length (mm) | 20 |
| Package Width (mm) | 20 |
| Package Height (mm) | 1.4 |
| Seated Plane Height (mm) | 1.6(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-026BFB |
| Family Name | Spartan®-6 LX |
| Maximum Number of User I/Os | 102 |
| Number of Registers | 93296 |
| RAM Bits | 3096Kbit |
| Device Logic Cells | 74637 |
| Process Technology | 45nm |
| Number of Multipliers | 264 (18x18) |
| Programmability | Yes |
| Transceiver Speed | 3.2Gbps |
| Program Memory Type | SRAM |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Dedicated DSP | 132 |
| Speed Grade | 3 |
| Device Number of DLLs/PLLs | 18 |
| Total Number of Block RAM | 172 |
| Cage Code | 68994 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Xilinx XC6SLX75-3TQG144C to view detailed technical specifications.
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