Field Programmable Gate Array (FPGA) with 74,637 logic cells and 93,296 registers, featuring 3096 Kbit of RAM and 132 dedicated DSP slices. This 45nm process technology device offers 408 maximum user I/Os and 264 18x18 multipliers. It operates with a 1V supply and supports transceiver speeds up to 3.2 Gbps. The component is housed in a 676-pin Fine Pitch Ball Grid Array (FBGA) package, measuring 27mm x 27mm x 1.73mm with a 1mm pin pitch, designed for surface mounting.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX75-L1FG676C technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 676 |
| PCB | 676 |
| Package Length (mm) | 27 |
| Package Width (mm) | 27 |
| Package Height (mm) | 1.73 |
| Seated Plane Height (mm) | 2.23 |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-034AAL-1 |
| Family Name | Spartan®-6 LX |
| Maximum Number of User I/Os | 408 |
| Number of Registers | 93296 |
| RAM Bits | 3096Kbit |
| Device Logic Cells | 74637 |
| Process Technology | 45nm |
| Number of Multipliers | 264 (18x18) |
| Programmability | Yes |
| Transceiver Speed | 3.2Gbps |
| Program Memory Type | SRAM |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Dedicated DSP | 132 |
| Speed Grade | 1L |
| Device Number of DLLs/PLLs | 18 |
| Total Number of Block RAM | 172 |
Compliance
| Cage Code | 68994 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | 3A991.d |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Xilinx XC6SLX75-L1FG676C Datasheet
Download the complete datasheet for Xilinx XC6SLX75-L1FG676C to view detailed technical specifications.
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