Field Programmable Gate Array (FPGA) with 74,637 logic cells and 93,296 registers, featuring 3096 Kbit RAM and 132 dedicated DSP blocks. This 45nm process technology device offers 106 user I/Os, 264 18x18 multipliers, and 8 transceiver blocks operating at 3.2 Gbps. The 196-pin Chip Scale Ball Grid Array (CSBGA) package measures 8x8x0.8mm with a 0.5mm pin pitch, suitable for surface mounting. Operating temperature range is 0°C to 85°C.
PackageCSBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX75T-2CPG196C technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
CSBGA
Package Description
Chip Scale Ball Grid Array
Lead Shape
Ball
Pin Count
196
PCB
196
Package Length (mm)
8
Package Width (mm)
8
Package Height (mm)
0.8
Seated Plane Height (mm)
1
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Family Name
Spartan®-6 LXT
Maximum Number of User I/Os
106
Number of Registers
93296
RAM Bits
3096Kbit
Device Logic Cells
74637
Process Technology
45nm
Number of Multipliers
264 (18x18)
Programmability
Yes
Transceiver Blocks
8
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Dedicated DSP
132
PCI Blocks
1
Speed Grade
2
Device Number of DLLs/PLLs
18
Total Number of Block RAM
172
Compliance
Cage Code
68994
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Xilinx XC6SLX75T-2CPG196C Datasheet
Download the complete datasheet for Xilinx XC6SLX75T-2CPG196C to view detailed technical specifications.
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