Field Programmable Gate Array (FPGA) with 74,637 logic cells and 93,296 registers, built on 45nm process technology. Features 3096 Kbit RAM bits, 264 integrated 18x18 multipliers, and 132 dedicated DSP blocks. Offers 106 maximum user I/Os, 8 transceiver blocks operating at 3.2 Gbps, and 1 PCI block. Packaged in a 196-pin Chip Scale Ball Grid Array (CSBGA) with a 0.5mm pin pitch, measuring 8x8x0.8mm, suitable for surface mounting. Operates across a temperature range of -40°C to 100°C.
PackageCSBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX75T-2CPG196I technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | CSBGA |
| Package Description | Chip Scale Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 196 |
| PCB | 196 |
| Package Length (mm) | 8 |
| Package Width (mm) | 8 |
| Package Height (mm) | 0.8 |
| Seated Plane Height (mm) | 1 |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | Spartan®-6 LXT |
| Maximum Number of User I/Os | 106 |
| Number of Registers | 93296 |
| RAM Bits | 3096Kbit |
| Device Logic Cells | 74637 |
| Process Technology | 45nm |
| Number of Multipliers | 264 (18x18) |
| Programmability | Yes |
| Transceiver Blocks | 8 |
| Transceiver Speed | 3.2Gbps |
| Program Memory Type | SRAM |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 100°C |
| Dedicated DSP | 132 |
| PCI Blocks | 1 |
| Speed Grade | 2 |
| Device Number of DLLs/PLLs | 18 |
| Total Number of Block RAM | 172 |
Compliance
| Cage Code | 68994 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU |
Datasheet
Xilinx XC6SLX75T-2CPG196I Datasheet
Download the complete datasheet for Xilinx XC6SLX75T-2CPG196I to view detailed technical specifications.
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