Field Programmable Gate Array (FPGA) with 74,637 logic cells and 93,296 registers, built on 45nm process technology. Features 3,096 Kbit RAM bits, 264 (18x18) multipliers, and 132 dedicated DSP slices. Offers 8 transceiver blocks operating at 3.2 Gbps and 1 PCI block. This surface-mount device is housed in a 900-pin FBGA package (31x31x1.75mm) with a 1mm pin pitch, supporting a maximum of 576 user I/Os and operating between -40°C and 100°C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX75T-2FG900I technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 900 |
| PCB | 900 |
| Package Length (mm) | 31 |
| Package Width (mm) | 31 |
| Package Height (mm) | 1.75 |
| Seated Plane Height (mm) | 2.25 |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-034 |
| Family Name | Spartan®-6 LXT |
| Maximum Number of User I/Os | 576 |
| Number of Registers | 93296 |
| RAM Bits | 3096Kbit |
| Device Logic Cells | 74637 |
| Process Technology | 45nm |
| Number of Multipliers | 264 (18x18) |
| Programmability | Yes |
| Transceiver Blocks | 8 |
| Transceiver Speed | 3.2Gbps |
| Program Memory Type | SRAM |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 100°C |
| Dedicated DSP | 132 |
| PCI Blocks | 1 |
| Speed Grade | 2 |
| Device Number of DLLs/PLLs | 18 |
| Total Number of Block RAM | 172 |
Compliance
| Cage Code | 68994 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | 3A991.d |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Xilinx XC6SLX75T-2FG900I Datasheet
Download the complete datasheet for Xilinx XC6SLX75T-2FG900I to view detailed technical specifications.
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