Field Programmable Gate Array (FPGA) with 74,637 logic cells and 45nm process technology. Features 186 maximum user I/Os, 93,296 registers, 3096 Kbit RAM bits, and 264 (18x18) multipliers. Includes 8 transceiver blocks operating at 3.2 Gbps, 132 dedicated DSPs, and 1 PCI block. Packaged in a 256-pin FTBGA (Fine Pitch Thin Ball Grid Array) with a 17mm x 17mm footprint, suitable for surface mounting. Operates across a temperature range of -40°C to 100°C.
PackageFTBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX75T-3FTG256I technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FTBGA
Package Description
Fine Pitch Thin Ball Grid Array
Lead Shape
Ball
Pin Count
256
PCB
256
Package Length (mm)
17
Package Width (mm)
17
Package Height (mm)
1
Seated Plane Height (mm)
1.4
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-034AAF-1
Family Name
Spartan®-6 LXT
Maximum Number of User I/Os
186
Number of Registers
93296
RAM Bits
3096Kbit
Device Logic Cells
74637
Process Technology
45nm
Number of Multipliers
264 (18x18)
Programmability
Yes
Transceiver Blocks
8
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
-40°C
Max Operating Temperature
100°C
Dedicated DSP
132
PCI Blocks
1
Speed Grade
3
Device Number of DLLs/PLLs
18
Total Number of Block RAM
172
Compliance
Cage Code
68994
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Xilinx XC6SLX75T-3FTG256I Datasheet
Download the complete datasheet for Xilinx XC6SLX75T-3FTG256I to view detailed technical specifications.
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